Key Features:
830 total tie points for complex circuit prototyping
Solderless design for quick assembly and modification
Standard 2.54mm (0.1") pitch compatible with most electronic components
630 terminal strip points and 200 power rail points
Clearly labeled rows and power rails for easy circuit layout
Reusable, durable ABS construction with nickel-plated contacts
Compatible with Arduino, Raspberry Pi, ESP32, sensors, LEDs, ICs, and jumper wires
Adhesive backing and interlocking design for flexible project setups
Specifications:
Model: MB102
Tie Points: 830
Dimensions: Approx. 165 × 55 × 10 mm
Suitable Wire Size: 20–29 AWG
Material: ABS Plastic with metal spring contacts
Package Includes:
1 × MB102 830-Point Solderless Breadboard